Team Lead, Co-Packaged Optics Packaging

Your mission The future of AI computing is light, not electrons. Q.ANT is building photonic processing systems that compute with light – delivering a scalable, energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications. As our Team Lead Co-Packaged Optics, you are the architectural and leadership anchor of our next-generation semiconductor packaging. You will build, coach, and scale a brand-new CPO Packaging Team from the ground up, driving the transition from concept phase to high-volume production. This role is about establishing absolute technical ownership at the intersection of photonics and electronics, bridging the gap between internal cutting-edge chip design and external global OSAT manufacturing. Your Responsibilities Leadership & Team Architecture: Build, mentor, and disciplinarily lead a high-performing CPO Packaging engineering team; execute gap analyses and strategic hiring to accelerate our scaling roadmap.OSAT & Supply Chain Mastery: Own the evaluation, qualification, and end-to-end technical management of global OSAT partners, ensuring the secure onboarding of at least two qualified CPO suppliers within 12 months.Technical Ownership (CPO & Fiber Attach): Drive the development of advanced co-packaged photonic/electronic assemblies, mastering deep hardware challenges across optical fiber coupling (Edge Coupling, FAUs), advanced packaging materials, and high-performance thermal management.Design for Excellence (DFM): Bridge the gap between engineering and mass manufacturing by implementing strict Design for Manufacturability (DFM) guidelines and ensuring reliability qualification under JEDEC and Telcordia standards.Cross-Functional Synergy: Act as the critical interface between internal Chip Design, Systems, Manufacturing, Test, and external supply chain stakeholders to ensure a seamless product introduction (NPI) and volume production roll-out.Continuous Engineering Quality: Champion rigorous root-cause analysis utilizing structured frameworks (8D, FMEA, Ishikawa) to rapidly resolve unexpected reliability or process deviations. Your profile Academic Foundation: You hold a Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or a closely related technical field.Semiconductor & OSAT Expertise: You possess at least 5 years of profound experience within the Semiconductor Packaging industry (Back-End / OSAT environment), with a proven track record in global supplier evaluation.CPO & Precision Hands-on Skills: You have direct, hands-on experience with Co-Packaged Optics (CPO) packaging, optical fiber attachment methods, and navigating advanced packaging materials (substrates, underfills, TIMs).Leadership & Empowerment: You have demonstrated experience in building, scaling, and coaching engineering teams, fostering a culture of high performance and technical accountability.Analytical Self-Leadership: You thrive in high-growth, innovative environments, demonstrating an advanced solution-oriented mindset and strong process ownership under tight project milestones.Communication Excellence: You possess exceptional written and verbal communication skills; fluency in English is required. Prior experience with glass substrates and proficiency in German are considered a distinct advantage for collaborating with local stakeholders. Why us? We hire for attitude and train for skills.We encourage self-responsibility and accelerate professional development.We move fast and encourage experimentation.You have the opportunity to be part of developing breakthrough photonic computing technology and have a lasting impact on the future of computing.You can be part of a passionate international, highly skilled cross-functional team.You will have access to the founders of the company.