Director, Process Engineering – Advanced Packaging (Customer-Facing) | Singapore

Our client, a leading global player in the semiconductor ecosystem, is looking for a senior technical leader to head its advanced packaging process team in Singapore. You’ll be the go-to expert for strategic semiconductor customers and lead a team that keeps their advanced packaging processes running at peak yield. What you’ll do Lead a team of 10+ engineers and managers who support key customers on-site.Act as the final escalation point for complex process issues, using root cause analysis, Design of Experiments (DOE), statistical process control (SPC) and failure analysis to drive yield improvement.Work with strategic customers to develop and optimise advanced packaging process flows, from process development and integration through qualification and production ramp.Lead technical evaluations, proof-of-concept activities and joint development programs on next-generation packaging technologies.Coordinate across engineering, product development, service and business teams to resolve issues fast and share learnings globally.Bring the voice of the customer back into product and technology roadmaps.Represent the business in senior and executive-level customer discussions. What we’re looking for 15+ years in the semiconductor industry, with deep hands-on experience in advanced packaging process development, process integration or customer engineering.Strong knowledge of technologies such as wafer-level packaging, Fan-Out, RDL, TSV, bumping, hybrid bonding, CoWoS, 2.5D/3D integration, heterogeneous integration, electroplating and CMP.Proven customer-facing experience managing demanding, high-volume semiconductor customers.Background from a semiconductor equipment supplier, foundry, IDM or OSAT. Chipmaker backgrounds are very welcome.Experience leading teams through middle managers, as a current Director or a Senior Manager ready for the next step.Degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, Mechanical Engineering or a related field. Master’s or PhD preferred. Location and package This role is based in Singapore. Relocation support is available for overseas candidates (relocation allowance, temporary accommodation and shipment support). Please note it’s a local package, not a full expat package.