Principal Packaging Engineer

My client is looking for a Principal Packaging Engineer, focused on advanced packaging architecture, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. This is an opportunity for an Engineer with a strong technical background, and leadership experience, looking to step into a Principal position. Responsibilities Architect advanced 2.5D/3D packaging and heterogeneous integration solutionsLead chiplet, interposer, TSV, high-density interconnect and hybrid bonding developmentTake packaging concepts from customer requirements through prototyping, demonstrators and qualificationDefine packaging technology roadmaps and drive long-term innovationLead multidisciplinary technical projects across design, assembly, thermal and testDevelop advanced microelectronic modules and system demonstratorsProvide technical leadership across design, validation and qualificationSupport hands-on prototyping and laboratory developmentContribute to technical proposals, bids and collaborative R&D programmesManage technical risks and support technology decisions with customers and partners Requirements Strong experience in advanced semiconductor packaging and heterogeneous integrationExpertise in 2.5D/3D packaging, chiplets and advanced assemblyExperience with substrates, interposers, TSVs and/or hybrid bondingProven experience leading semiconductor packaging development projectsUnderstanding of the full packaging lifecycle from design through qualificationKnowledge of signal integrity, power integrity and thermal managementExperience taking R&D concepts through to working prototypes or demonstratorsStrong technical leadership, problem-solving and communication skillsExperience in AI, HPC, telecoms or photonics is desired but not a must Benefits Competitive salary + bonusSponsorship + Relocation assistanceCompany pensionPrivate healthcare for you and your familyHybrid working to fit around your schedule A healthy work environment, with great work life balance If you are interested, contact Ella Flynn at IC Resources.