Summary
✨ AI‑Generated
An advanced semiconductor organization is looking for a development engineer who can also lead projects in power GaN metallization. You will develop 300 mm copper metallization and pad technologies, guide back-end-of-line development activities, and transfer successful process concepts into manufacturing. The role combines technical depth, cross-functional collaboration, process optimization, and project ownership.
Highlights
Work on advanced GaN-based power semiconductor technology within an international development team. The position combines hands-on process innovation with project leadership, taking metallization technologies from concept through manufacturing implementation while focusing on stability, yield, reliability, and cost.
Description
Join an international development team and help shape the future of power electronics with GaN-based power semiconductor technologies.
In this role, you will combine technical innovation with project leadership responsibilities, driving advanced metallization solutions from the initial process concept through to successful implementation in manufacturing.
Your role
Key responsibilities in your new role
Develop 300 mm front-end Cu metallization and pad technologies for GaN-based power semiconductor applications, from process concept to transfer into productionTake on project leadership responsibilities for BEOL technology development activities in Dresden and support ambitious project plans to accelerate time-to-marketDrive the development and implementation of metallization concepts with a focus on stability, yield, reliability, and manufacturing costsCollaborate closely with process development engineers to define, implement, and optimize process requirementsWork in multinational and cross-site development teams, with project management based in Villach, Austria, and team leadership in Regensburg, Germany
Your profile
Qualifications And Skills To Help You Succeed
A university degree in Microsystems Engineering, Electrical Engineering, Physics, or a related scientific or engineering disciplineAt least 5 years of relevant experience in process technology development and/or process integration, ideally within semiconductor metallizationProven skills in technical leadership and project managementA high level of initiative, ownership, and motivationStrong communication and collaboration skills in international environmentsFluency in both German and English, with the ability to communicate and present effectively in both languages
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Nicole Hippmann
