Deposition, Metallization & Plating Engineer

Open role Deposition, Metallization & Plating Engineer Why this work matters Touchdown is engineering modular manufacturing for the chips and memory systems future computing needs. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today. Overview You will define the material and conductor stack required by a specific device or package layer, then compare feasible deposition, seed, plating, and finish routes. A process choice has to survive both inline metrology and downstream electrical and reliability tests. Early work is a specification and controlled comparison with qualified suppliers; hands-on trials require approved equipment, chemistry, and facilities. What you will own Specify films and conductors, adhesion, seed/plating or other selected routes, uniformity, contamination, and electrical effects.Specify film stack, conductor geometry, adhesion, sheet resistance, uniformity, and contamination limits.Compare deposition, seed, plating, anneal, and finish options for a named package layer.Coordinate chemical, electrical, thermal, and reliability measurements with qualified owners.Connect material specifications and tool settings to electrical resistance, interface integrity, and package reliability.Define control samples, measurement methods, and corrective actions for film variation or plating defects. Technical territory Thin films and surface preparation; physical or chemical deposition where appropriate; seed layers, electroplating, metallization, adhesion, sheet resistance, thickness uniformity, contamination, thermal exposure, corrosion, tool controls, and waste handling. Representative outputs A layer-specific process and measurement plan with thickness, adhesion, resistance, defects, and safety limits.A layer-specific recipe and incoming-material specification with process window.A measurement and reliability matrix, including failure and stop criteria.A supplier and process comparison with material inputs, tool capability, measurement uncertainty, environmental controls, and accepted-good cost. What success looks like Film or conductor variation stays inside the customer CTQ budget.A failed layer can be traced to material, tool, recipe, or measurement.The selected stack meets product electrical and reliability limits across the claimed workpiece range.Any process drift can be detected, held, and traced before affected material moves downstream. What you bring Thin films, PVD/CVD, plating or related metallization, equipment controls, and reliability testing.Hands-on thin-film or plating process development and qualification.Can interpret thickness maps, electrical resistance, adhesion, and defect data.Understands equipment controls, chemistry hazards, and cross-process contamination.Experience with process qualification, film or plating metrology, and defect investigation.Understanding of chemical safety, equipment controls, and the effect of upstream preparation on film performance. Helpful experience RDL copper and barrier/seed stacksPVD, CVD, ALD, electroplating, or CMP interfacesRedistribution layers and package interconnectsSurface analysis and failure analysisSupplier-to-site process transfer How the role works Applications are open; the exact work location, arrangement, compensation, and start date will be discussed during hiring.Early work can produce engineering plans and partner comparisons. Hands-on work begins only at qualified, authorized facilities.You will work with process, equipment, quality, test, customer, and supplier owners as the scope requires. Apply for this role → Show a real process, tool, workpiece, or product decision you owned, the measurements behind it, and what another team could reproduce.