Director of Engineering

Director of Engineering Company: SwiftLink Technologies Inc. Location: On-Site — Corporate & Engineering Facilities Position Type: Full-Time, Senior Leadership About SwiftLink TechnologiesSwiftLink Technologies is pioneering next-generation Electromagnetic Integration/Embedded Micro-Band (EMB) chip technologies and monolithic Millimeter-Wave (mmWave) RFIC/SoC solutions. Our mission is to transform global connectivity across 5G/6G networks, Non-Terrestrial Networks (NTN), Low Earth Orbit (LEO) satellite communications, and high-capacity phased-array systems. We build ultra-dense, low-power microelectronics that simplify complex beamforming architectures and deliver multi-gigabit performance for ground terminals, space-borne transceivers, and telecom infrastructure. Position SummaryWe are seeking an experienced Director of Engineering to lead our multidisciplinary engineering organization and command the end-to-end realization of our product portfolio. Reporting directly to the executive leadership team (CEO/CTO), you will bridge architectural vision with commercial market execution. You will oversee deep-tech pathfinding, silicon design, advanced packaging, post-silicon validation, volume manufacturing enablement, and customer design-ins. If you thrive in a fast-paced environment, possess deep semiconductor expertise, and excel at building high-performing technical teams, this executive leadership role is for you. Key ResponsibilitiesEngineering Leadership & Strategy: Build, scale, and mentor a multidisciplinary organization spanning RFIC, mixed-signal IC, SoC, digital architecture, antenna, advanced packaging, software/firmware, test, and applications engineering. Define 3-to-5-year technical execution roadmaps aligned with corporate strategy.Full-Lifecycle Silicon Delivery: Oversee the product lifecycle from initial feasibility and architecture planning through tapeout, post-silicon validation, product qualification, customer sampling, and volume mass production.EMB & mmWave Program Management: Supervise complex development programs for high-frequency (10 GHz to 100+ GHz) mmWave RFICs, phased-array beamformers, power amplifiers, LNAs, synthesizers, and high-speed data converters.Foundry & Ecosystem Governance: Manage technical relationships and production allocations with silicon foundries (e.g., TSMC, GlobalFoundries, Tower), OSAT packaging houses, testing facilities, and EDA vendors.Execution Discipline & Process: Implement rigorous engineering gate reviews (PDR, CDR, Tapeout Sign-off, PRR) and continuous verification methodologies to ensure first-pass functional silicon success.Leadership Hiring: Play a direct role in structuring and scaling the engineering team, including the immediate recruitment and integration of key leadership positions such as the Testing & Applications Manager.Cross-Functional & Executive Collaboration: Work closely with BD, Sales, and Product Management to support customer design-in activities, technical demonstrations, investor updates, and board reviews. QualificationsEducationMaster’s Degree in Electrical Engineering, RF/Microwave Engineering, Microelectronics, Communications Engineering, or a related field required.Ph.D. focusing on mmWave RFIC design, phased-array architectures, or SoC integration preferred (equivalent industry track record will be weighed equally).Experience & Technical Skills10+ years of engineering experience in semiconductors, RFIC/SoC development, wireless infrastructure, or satellite communications.5+ years in engineering leadership, managing multidisciplinary engineering teams.Demonstrated Silicon Track Record: Proven history of leading complex RFIC/SoC products from initial concept through tapeout, qualification, and high-volume commercial delivery.Technical Depth: Deep knowledge of modern silicon technologies (RF-SOI, SiGe BiCMOS, CMOS, FinFET), mmWave circuit design, phased-array systems, active beamforming, and satellite/5G link budgets.Validation & Operations: Strong understanding of post-silicon bring-up, ATE testing, PVT characterization, yield optimization, and packaging technologies (SiP, WLCSP, Flip-Chip).Startup Agility: Comfortable working in an innovative, fast-paced environment where hands-on execution, cross-functional collaboration, and speed-to-market are critical. Key CompetenciesEnd-to-end semiconductor product execution.Technical problem-solving and sound engineering judgment.High-performance team building and mentorship.Project milestone discipline and technical risk mitigation.Clear executive presentation and stakeholder communication skills. Benefits & PerksCompetitive executive base salary + performance bonuses.Employee Stock Purchase Plan (ESPP) / Equity opportunities.Comprehensive Dental Care.Extended Health Care coverage.Vision Care plan.On-site parking at our engineering facility. Work LocationIn-Person (SwiftLink Technologies Engineering & Corporate Headquarters).