Senior 3D Packaging and Tooling Engineer

Quantware — Netherlands · Posted ~3 hours ago

Senior Full-time Visa History ✓

Skills

3D packaging precision assembly tooling design mechanical engineering high-precision manufacturing precision assembly machines 3D packaging tools

🔓 Log in to save this job, tailor your resume & track your apply process — 7 days free, no card needed.

Log in to add to target list

Summary ✨ AI‑Generated

A senior engineering role focused on developing and optimizing high-precision physical systems. The position involves adapting advanced manufacturing equipment, designing custom tooling solutions, and solving complex assembly challenges for next-generation technology products.

Highlights

Opportunity to lead advanced hardware realization projects involving cutting-edge precision engineering, novel architectures, and challenging manufacturing processes.

Description

About Us QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors. With VIO, we are paving the way for the hyper-scale quantum computers that will change the world. And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time. That’s where you come in! As a 3D Packaging & Tooling Engineer, you won't just be running a recipe, you will be the lead architect for how our VIO products are physically realized. You will take high-precision assembly machines and push them beyond their factory specs to handle novel 3D architectures and the precise tolerances required for optimal device performance. What You'll Be Doing Tooling Adaptation: Lead the modification and customization of high-precision assembly equipment (e.g., flip-chip bonders, die attaches) to meet unique quantum 3D integration requirements.Advanced Process Development: Develop sub-micron placement and bonding processes (thermo-compression bonding, laser-assisted bonding, coldwelding) for non-standard substrates. Lead the evaluation of glues, adhesives, and solder materials. You will determine which materials can meet our alignment requirements while surviving the extreme thermal cycling and vacuum conditions of a dilution refrigerator.Non-Standard 3D Assembly: Design and execute "out-of-the-box" integration strategies, including multi-die stacking, interposer-based 3D architectures, and orthogonal (vertical) chip placement.Vendor Management: Interface directly with equipment manufacturers to drive co-development of specialized hardware. Your Profile Education: BS/MS/PhD in Mechanical Engineering, Mechatronics, Physics, or Materials Science.Deep Tooling Fluency: 7+ years of hands-on experience with high-accuracy semiconductor assembly platforms. You are the person who knows which bolts to turn and which sensors to override to get the results you need.Precision Assembly Expertise: Proven track record of achieving